Auto Molding System In Semiconductor Fabrication Equipment 1000 Tons Capacity

Auto Molding System in Semiconductor

Features:

● Full servo control system, PLC (Omron) + controller;

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● Automatic cassette loading, double cassette stacked loading;

● Supports flexible expansion of up to 4 groups of presses to realize high UPH;

● Equipped with vision system to recognize the feeding direction;

Technical Parameters:

Customization:

• Brand Name: TJIN
• Model Number: 001
• Place of Origin: China
• Certification: ISO9001
• Minimum Order Quantity: 1
• Packaging Details: Wooden Packaging
• Delivery Time: 40 days
• Payment Terms: TT
• Platen Size: 600 X 600 Mm
• Heating Power: 12 KW
• Screw Diameter: 35 Mm
• Capacity: 100 Tons
• Control System: PLC

This Semiconductor Molding Machine, model number 001, is designed and manufactured by TJIN in China. It is certified with ISO9001 and has a minimum order quantity of 1 unit. The packaging details include wooden packaging for safe delivery. The delivery time for this machine is 40 days and the payment terms are TT.

The platen size of this machine is 600 X 600 mm, with a heating power of 12 KW and a screw diameter of 35 mm. It has a capacity of 100 tons and is equipped with a PLC control system for efficient operation.

At TJIN, we understand the importance of customization for our customers. That's why we offer a customization service for our Semiconductor Molding Machine. Our expert team will work with you to tailor the machine to fit your specific needs and requirements. With our customization service, you can ensure that the machine meets all your production needs and delivers the best results.

Invest in our Semiconductor Molding Machine with our customization service and experience the benefits of efficient and effective auto packaging equipment for your business.

Packing and Shipping:

The Semiconductor Molding Machine will be carefully packaged and shipped to ensure its safe arrival at your designated location. Our packaging process follows industry standards and is designed to protect the machine from any potential damage during transit.

The machine will be first wrapped in a layer of protective material, such as bubble wrap or foam, to prevent any scratches or dents. It will then be placed in a sturdy cardboard box with additional padding for added protection.

In addition, any delicate parts or components will be individually wrapped and secured to prevent any potential damage during transportation.

We offer both domestic and international shipping options for our customers. All shipments will be made through reputable carriers, such as FedEx or DHL, to ensure timely and reliable delivery.

For international shipments, we will handle all necessary customs and documentation to ensure a smooth delivery process. However, please note that any additional customs fees or taxes imposed by the destination country will be the responsibility of the customer.

Once your order has been shipped, you will receive a tracking number to monitor the progress of your delivery. Our team will also stay in touch to provide any updates or address any concerns that may arise during the shipping process.

Upon arrival, please carefully inspect the package for any signs of damage. If there are any issues, please contact us immediately so we can assist in resolving the issue.

Thank you for choosing our Semiconductor Molding Machine. We are committed to providing the best packaging and shipping services to ensure your satisfaction with our product. If you have any further questions or concerns, please do not hesitate to contact us.

Performance Parameters:

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

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