: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength

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Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength

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Product Tags:

HRC50 Lead Frame IC Mold

NAK80 Lead Frame IC Mold

high strength Lead Frame stamping mold

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