: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making

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PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making

Automatic Encapsulation Equipment Features Product Name: Semiconductor Molding Machine Injection Unit: Single Type: Vertical Injection Molding Machine Platen Size: 600 X 600 Mm Injection Pressure: ...

Product Tags:

auto semiconductor encapsulation

auto semiconductor making machine

plc control semiconductor encapsulation

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